PPT Topics

Jul 26, 2016

Miniaturization of Mechanical Systems Full Paper

Miniaturization of Mechanical Engineering Systems pdf full abstract presentation paper journal ppt Abstract: This paper will offer an overview of evolution of miniaturization of engineering systems and devices that was initiated a half century ago. The trend of further miniaturization of devices to the ultimate atomic scale will not only continue it will become a dominant technological development in the first half of the new century if not longer. Such development will require significant changes in every aspect of design and manufacture, as well as production management over traditional engineering practices. Production of miniaturized device components and engineering systems of micro- and nanoscale is clearly beyond the capability of current machine tools. Shaping device components of complex geometry in micrometer scale with high dimensional accuracy requires the use of specific and carefully controlled physical-chemical processes. Many of these processes result in adverse or intrinsic effects that need to be accounted for in early stage of design considerations. The nature of the minute sizes of these products also creates many problems in assembly, packaging and testing.

 Download Full Paper Click Here

Miniaturization of Electronics Systems full paper

Miniaturized Electronics pdf full abstract presentation paper journal ppt
Abstract: Semiconductor device and circuit technology, coupled with its associated electronic packaging, forms the backbone of high-performance miniaturized electronic systems. This article examines some of the current and future electronic device technology that is, or will be, important to APL. I t also looks at the latest trends in packaging and how packaging is key to the development of high-performance systems. This integration of advanced devices with high-density packaging has been a cornerstone of APL activities, ranging from the VT fuze to the latest satellite. A glimpse into the potential of increased silicon integration, wide bandgap semiconductors, and carbon nanotubes for greater device performance is presented. The packaging discussion focuses on advanced interconnect and the use of flexible substrates.

 Download Full Paper Click Here